CRA HSC67-6G | HEAT SINK COMPOUND 6G SQUEEZE TUBE

CRA HSC67-6G
HEAT SINK COMPOUND 6G SQUEEZE TUBE

Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). Contains: Zinc oxide and polydimethyl siloxane. Transfer heat away from heat sinks, transistors, power diodes, semi-conductors ballast’s & thermocouple wells. Thermal Conductivity: 0.67 Watts per meter K. Specific Gravity: 2.1 at 25OC. Silicone and Zinc Oxides. Viscosity: 542000 mPa.s. Shelf Life: 60 months.